Front panel consist of two boards. One of them is CPU board with main microcontroller AtXMEGA128A3U-AU, main dial optical encoder BOURNS, mechanical encoders, dual concentric potentiometer AF/RF. This board holds LCD&switch PCB.
RGO ONE Main Board (MB) or so called mother board fits all connectors on the rear panel, power supply, I/O controller (second CPU). MB is also intended to be a chassis for all RF boards and options, as long as
LO board provides all oscillator signals needed for signal conversion and mixing. The board consists of the following components: – LO first oscillator realized by U2 – SI570 (570CAC000141DG), 3 switchable low pass filters: 10.8-15MHz; 15-24MHz; 24-39MHz. Filter switching is
RX MIXER standard is ADE-1 diode ring mixer. Here described is optional high dynamic range H-mode mixer. The schematic and original H-mode mixer concept has been designed by Colin Horrabin G3SBI and further developed by Martein Bakker PA3AKE. PCB component
RF MIXER board does all RX/TX signals on IF and operation frequencies. On receive the signal comes on CX3 coaxial connector, then passes (or not) through input attenuator R10,R13,R14, then via switches come to BPF board. IF TRAP circuitry consists
This unit includes the following: intermediate frequency IF amplification – MC1350 optional crystal filter (4 pole variable crystal Jones type filter) RX product detector – SA612 AF preamplifier – MC33079DG RX MUTE and sidetone input circuitry AF final amplifier –
In order to form DSB/CW modulation on TX, a SSBGEN board is used. It consists of the following parts: Microphone preamplifier and TX audio amplifier – TL082 Switched input: LINE IN or MIC (MUX 4053) DSB modulator – SA612 CW
Six band pass filters were built to cover 10-80m bands on RX. Schematic utilizes Skywork solutions AS169 PHEMT GaAs SPDT switches, used in modern wirelless equipments. In order to perform individually “fine tune” a variable coil inductors are used. The
Final 50W amplifier is designed using 4pcs. QFET N-MOS FAIRCHILD FQP13N10 transistor. The module consist of three stages: predriver with NXP PD85004, driver in push-pull configuration (2xPD85004) and final unit utilizing 4pcs. (2 by 2 push-pull in parallel) FQP13N10 transistors
This board consist of the following modules: 5 sub PCB with low pass filters chebyshev type for all HF bands. There is place where to be nested one optional LPF subboard (for 160m) High voltage (210V) scheme (voltage tripler) Antenna