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Power amplifier building process: Power amplifier consist of two sandwich nested printed circuit boards – PA linear 55W board and low pass filter module.

Here is some pictures of LO board – ready and shielded Copper straps are added in order to improve ground on the board

By now all printed circuit boards are ready and populated. We have also some boards – completely tested and aligned: 1. IF/AF board 2. RF MIXER board 3. LO/tones board. 4. Front panel assembly – CPU, LCD/switches boards 5. Both

Today we made continuity and DC test of the front panel assembly consisting of: CPU board LCD&switch board All tests passed OK and tomorrow face panel’s CPU will be flashed for the first time

We recently received first ten sets of printed circuit boards for RGO ONE HF transceiver. So till today we managed to populate some of the boards. Rgo one consist of 20 pcb’s … so a lot of work lies ahead.

Search and pounce in LZ DX contest with RGO ONE. Testing new features – DTR/RTS keying from N1MM contest logger; Testing temperature management with new FAN cradle.    

Here is in summary what happened after Dayton HAM vention. We noticed some issues in spectral purity in RGO ONE transmit part. So we had to move it back to design stage and for almost three months we dealt with

Thanks to all who wrote me with questions, interest, expectations and positive “WOW” feedbacks. This urged us to move fast forward and start production of the first ten ready-to-use units. We plan to have them finished till next months. Then

After the successful presentation start of RGO one we made some contacts on 40/20 meters. Here is a short video of a special event station for the hamvention – W8BI